
Engineered for high flow rates and drip-free disconnection, UQDB couplings are the premier choice for in-rack applications requiring blind-mate alignment and displacement compensation.
SWAK provides a comprehensive range of Universal Quick Disconnect Blind-mate (UQDB) couplings, available in UQDB02, UQDB04, UQDB06, and UQDB08 sizes. Specifically engineered for the next generation of High-Performance Computing (HPC) and data center liquid cooling architectures, the UQDB follows the open standard initiated by Intel and matured through the Open Compute Project (OCP).
As a standardized blind-mate interface, the UQDB ensures full interoperability and cross-manufacturer compatibility, allowing for seamless connection even in restricted spaces where manual alignment is difficult. Leveraging SWAK’s decades of expertise in high-precision manufacturing, our UQDB series is meticulously crafted to meet and exceed OCP specifications, providing superior mechanical alignment, optimized flow performance, and long-term leak-free reliability for mission-critical liquid-cooled server environments.
✓ OCP Compliant Architecture: Engineered in strict accordance with OCP UQD/UQDB specifications for open-standard interoperability.
✓ Precision Blind-Mate Design: Optimized for slide-in rack integration, allowing for seamless connection in restricted spaces where manual access is limited.
✓ Superior Alignment Tolerance: Features an allowable X, Y radial displacement of ±1 mm, ensuring reliable coupling even with minor manifold misalignments.
✓ Optimized Fluid Dynamics: High-flow performance paired with a guaranteed non-spill design to protect sensitive IT equipment.
✓ Advanced Valve Technology: Equipped with double shut-off flat-face valves to prevent fluid loss during connection and disconnection.
✓ Ergonomic Efficiency: Delivers best-in-class force-to-connect, reducing mechanical stress on server chassis and rack structures.
✓ Premium Material Integrity: Standard construction uses 316L stainless steel for exceptional corrosion resistance and broad fluid compatibility.
✓ High-Performance Sealing: Utilizes peroxide-cured EPDM-P seals to ensure long-term stability in high-temperature liquid cooling loops.
✓ Exceeds Industry Benchmarks: Flow ratings surpass OCP standards by at least 25%, significantly lowering pressure drop and total energy consumption.
✓ Space-Efficient Form Factor: Available in compact socket versions for sizes -02, -04, -06, and -08, specifically designed for ultra-high-density data center environments.

Please refer to SWAK Liquid Cooling datasheet UQDB Series
Copyright © 2026 SWAK. All Rights Resvered.